Publication Number
WO/2023/057525
Publication Date
13.04.2023
International Application No.
PCT/EP2022/077727
International Filing Date
05.10.2022
Title
[English]
SOURCE WAFER, METHOD, AND OPTOELECTRONIC DEVICES
[French]
TRANCHE SOURCE, PROCÉDÉ ET DISPOSITIFS OPTOÉLECTRONIQUES
Applicants **
ROCKLEY PHOTONICS LIMITED
1 Ashley Road
3rd Floor
Altrincham Cheshire WA14 2DT, GB
Inventors **
YANG, Hua
c/o Rockley Photonics Ireland
13-18 City Quay
Dublin, 2, IE
DERNAIKA, Mohamad
c/o Rockley Photonics Ireland
13-18 City Quay
Dublin, 2, IE
PETERS, Frank
c/o Rockley Photonics Ireland
13-18 City Quay
Dublin, 2, IE
YU, Guomin
c/o Rockley Photonics, Inc.
234 East Colorado Boulevard
Suite 600
Pasadena, California 91101, US
Priority Data
2114242.7
05.10.2021
GB
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Abstract
[English]
A source wafer for use in a micro-transfer printing process. The source wafer comprising: a wafer substrate; a photonic component, provided in a device coupon, the device coupon being attached to the wafer substrate via a release layer; and one or more etch stop layers, located between the photonic component and the wafer substrate.
[French]
Tranche source destinée à être utilisée dans un processus d'impression par micro-transfert. La tranche source comprend : un substrat de tranche; un composant photonique, agencé dans un coupon de dispositif, le coupon de dispositif étant fixé au substrat de tranche par l'intermédiaire d'une couche de libération; et une ou plusieurs couches d'arrêt de gravure situées entre le composant photonique et le substrat de tranche.